I would like the V to be more easily openable, but...
Having taken the V apart and thinking about the hardware changeability critically, what are the components that can actually be changed in a device of this size?
Packaging all the components into a device of this size is always going to be a challenge.
RAM - The lowest (stack) height SO DIMM DDR3(L) socket that I could quickly find is 4 millimetres high. The actual height with the SO DIMM DDR3(L) memory module is a bit more to my understanding.
Add to this the motherboard thickness - about 1 millimetre - and you have a stack of 5+ millimetres. And then there needs to a gap between the motherboard and the shell, let's say 0,5 millimetres and you are closer to 6 than 5 millimetres.
Add to this the display assembly thickness - about 2,5 millimetres - and the shell thickness of 0,5 - 1,0 millimetres.
And the device thickness has grown to something like 9,5 - 10 millimetres minimum, probably 0,5 - 1,0 millimetres more for practical reasons.
So to have replaceable memory modules, that would make the device at least 9,5 - 11,0 millimetres thick.
It may be possible somehow to connect the SO DIMM socket to the motherboard edge instead of stacking them on top of the motherboard, but there is also the problem of area taken by all this as the SO DIMM memory modules are a lot larger than surface soldered memory chips.
This is thoughts only about SO DIMM memory modules. There may be another way to have replaceable memory modules, but I'm not currently aware of such components.
CPU - The same applies to CPU as to RAM, the stack height is in the same region as with RAM (probably more with the cooling solution).
Battery - Totally user replaceable and with stretchy double sided tape (the tape has a tab and it stretches when pulled and loses adhesion) very easy to replace in fact. However there are safety issues to consider as the "soft" battery is vulnerable. And the battery cost is a lot higher with a plastic shell and then the battery assembly also becomes thicker.
SSD - On the V the SSD is screw secured in place and is easily replaced.
Display - Easily replaced if screw attached and the connectors are easily opened.
So, in practice the replaceable components could be the motherboard with the CPU and RAM and other components soldered to it (on the V the motherboard is attached with screws), the battery, the SSD and naturally also the display assembly.
However, I don't think that there is a sufficient demand for upgrading a device with a new motherboard with all the necessary components soldered to it and hence, its price would be quite high. Remember that the CPU itself costs between $281 for the m3-7Y30 and $393 for the i7-7Y75 (Intel recommended customer prices). And these CPUs are anyways only available as surface soldered components.
With this option the case could be almost as thin as now, maybe only about 0,5 - 1,0 millimetres thicker to accommodate for the screw attachment of display and shell parts.
There are all sorts of technical, manufacturing, warranty and quality issues with an openable device, and obviously this would have an impact on the device cost.
As nice as it would be to have an easily openable device, please consider how much the customers and how many of them are actually willing to pay for such a facility. And to buy new components and replace them instead of buying a new device. And think about the manufacturing and storage costs of such low volume items.
Nice to have, but ...